Chip equipment maker Besi fields takeover interest on surging demand for advanced chip packaging: Report
Published on: March 13, 2026, 7:33 p.m. | Source: The Economic Times
BE Semiconductor Industries is drawing takeover interest. Its advanced chip-packaging technology is highly strategic. Lam Research and Applied Materials are among potential suitors. Besi is working with Morgan Stanley to evaluate offers. The company's shares saw a significant jump on the news. Besi is a key player in hybrid bonding technology for AI chips.
