Odisha Sets the Stage for India's Semiconductor Success with 3D Glass Chip Packaging Unit
Published on: April 19, 2026, 2:54 p.m. | Source: Devdiscourse
Odisha's Chief Minister Mohan Charan Majhi, alongside Union Minister Ashwini Vaishnaw, launched India's first advanced 3D glass chip packaging unit in Bhubaneswar. This groundbreaking project marks India's entry into advanced semiconductor technology, promising substantial employment opportunities and elevating Odisha's status in global electronics manufacturing.
